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PRODUCT
德律TR7007SII 3D SPI锡膏测厚仪
发布时间: 2021-12-01 01:31
德律TR7007SII 3D SPI锡膏测厚仪，检测速度高达200cm2/sec，高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测，分辨率包含15µm or 10µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。此系列亦有双轨架构之机型，在不增加机台落地空间下，大幅提升了生产线的产能。
特点：
业界最快速的锡膏印刷检测机
无阴影条纹光检测技术
光学分辨率提供10 µm 及 15 µm 两种选择
X-Y table线性马达可提供无震动精确检测
规格参数：
Optical System
Imaging Method | Dynamic Imaging |
Camera | 4 Mpix |
Imaging Resolution | 10 µm or 15 µm (factory setting) |
Lighting | RGB LED |
3D Technology | 2-way Digital Fringe Pattern |
Field of View | 4 Mpix@ 10 µm: 20 x 20 mm |
Inspection Performance
Imaging Speed | 4 Mpix@ 10 µm: 90 cm²/sec |
Height Resolution | 0.4 µm |
Max. Solder Height | @ 10 µm: 420 µm |
Motion Table & Control
X-Axis Control | Linear Motor and linear scale with DSP-based controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller |
X-Y Axis Resolution | 0.5 µm |
Z-Axis Resolution | 1 µm |
Board Handling
Max PCB Size | 510 x 460 mm* |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 40 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height | 880 – 920 mm |
Inspection Functions
Defects | Insufficient Paste |
Measurement | Height |
Dimensions
WxDxH | TR7007 SII: 1220 x 1663 x 1620 |
Weight | TR7007 SII: 920 kg |